испаравање

испаравање

One of the final steps in processing a wafer during which conductive metal, usually aluminum, is deposited on the surface of the wafer in order to provide electrical interconnection of the various active elements on each die. Metallization may also be accomplished through sputtering.

0 0

향상

이미지 추가

품사: 명사
동의어:
용어블로그:
분야/도메인: 반도체
카테고리: 반도체 품질
Company: National Semiconductor
제품:
두문어-약어:

자세히

내 용어집에 추가

기타 언어:

자세히

하고 싶은 말

유사 용어 보기

софтвер

반도체; 반도체 품질

The instructions which program or sequence the functioning of the hardware of a device or system. These instructions may be contained internally (in ROM, for example) or ...

активани уређај

반도체; 반도체 품질

A device which, when subjected to a current or voltage, exhibits either gain (amplification) and/or control characteristics, or a device which converts input signal energy into ...

алфа честице

반도체; 반도체 품질

Helium nuclei emitted as a result of the radioactive decay of trace amounts of naturally occurring uranium and thorium found in semiconductor packaging materials. Alpha particles, ...

аналогни уређај

반도체; 반도체 품질

A microcircuit in which the output is a mathematical function of the input.

архитектура

반도체; 반도체 품질

The functional design of a complex component, circuit or system, including both its hardware and its compatibility with external hardware and software.

статичка РАМ меморије

반도체; 반도체 품질

See RAM.

뉴스 속의 용어

Ускрс

An annual Christian festival in commemoration of the resurrection of Jesus Christ, observed on the first Sunday after the first full moon after the ...